UBOTIC's air cavity packages meet the high-performance technical requirements of electronic component packaging. Utilizing the high performance Liquid Crystal Polymer material technology, UBOTIC's air cavity packages are able to withstand harsh environments, intense shock and vibration, extreme temperatures and severe humidity, while delivering high reliability and dimensional stability at significantly reduced costs.



  • Specialize In MEMS Packaging Materials, IC Packaging & Product Transfers
  • Air Cavity and Injection Molded Packaging
  • Flexible MEMS Services To Our Clients
  • Speed To Product Delivery
Please enter your details and your enquiry
Full Name:
Email Address:
Company Name:
One of our Sales Managers will be in contact with you soon.
  •    North America
  •    Europe
  •    South Korea
  •    China
  •    Taiwan / Hong Kong
  •    Singapore / Malaysia / Thailand
  •    Philippines

Your Message has been sent to us. Our sales will contact you shortly.